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SMT Gasket 1
SMT Gasket 1

SMT Gasket

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    This is a patch of conductive silicone

    This is a patch of conductive silicone foam that can be attached to a PCB using the SMT process.It has good electrical conductivity and excellent elasticity after reflow soldering and can be used as an EMI shielding ground or as an alternative to mechanical antenna shrapnel.At the same time, when the whole machine is subjected to external impact force, the product has a buffering function to avoid damage to other components by the impact force.


    1620183233g0e
    1620183233oxz

    SMT Gasket Specification

    We independently developed a highly conductive PI film, which is the first in China. The total thickness can be 0.018mm, the surface resistance can be within 0.03Ω (the actual measurement is around 0.01Ω), and 3 related patents have been extended.


    Reflow temperature curve setting

    SMT Gasket 4
    1620183233rje

    Specification of tinned SMT Gasket

    Reliability test of SMT Gasket


    Product

    SMT Gasket

    Metal spring Gasket

    Conductive cloth Gasket

    Material

    Silicone rubber

    Metal

    Resin

    Operation

    SMT

    SMT

    Manual Operation

    Bonding

    Welding

    Welding

    Adhesive

    Conduction

    ⭐⭐⭐

    ⭐⭐

    Performance

    ⭐⭐⭐

    ⭐⭐

    Contact area

    Wide

    Narrow

    Narrow

    Size

    Customizable

    Limit

    Customizable

    Reliability

    Better

    Easy to break

    Easy to fall off

    Installation time

    Less

    Less

    More

    FAQ

    1
    Preheating zone. It is suggested that 150 ℃ should be used.
    the heating rate should be 1 ~ 1.5 ℃ / s, and the time should be 100 ~ 120s.
    2
    Activation zone. For different fluxes, the activation temperature is different.
    The heating rate is recommended to be 0.3 ℃ / s, and the final heating temperature is about 180 ℃. The recommended time is 90 ~ 120s.
    3
    Fast heating zone. The heating rate is recommended.
    to be about 2 ℃ / s, and the time is recommended to be 15 ~ 20 s.
    4
    Reflux zone.
    It is recommended to refer to the data provided by the solder paste manufacturer for the selection of the peak temperature and overall reflux zone time. Different types of solder have different requirements for reflow temperature. The peak temperature is generally 240 ~ 250 ℃. The time of the whole reflux zone is recommended to be 40 ~ 80s. The residence time at the peak temperature is generally less than 10s.
    5
    Cooling zone. It is suggested.
    that the temperature change rate should be consistent with that in the rapid heating zone, and it is suggested to set it at 1 ~ 3 ℃ / s.
    6
    What kind of certificate you have ?
    We have ISO9001, ISO14001,PED,SGS.
    Recommended
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